US Pours $300 Million Into GlobalFoundries for Faster AI Chip Interconnects
The U.S. government is backing GlobalFoundries with a $300 million award to advance the development of faster chip interconnects tailored for AI workloads. The funding, administered through the CHIPS Act program, aims to improve how data travels between processors and memory — a critical bottleneck as AI models grow in scale and complexity.
Faster interconnects allow AI chips to exchange data more efficiently, reducing latency and boosting throughput in data centers that train and run large language models. GlobalFoundries operates fabrication facilities in the U.S. and Germany, and the project is expected to strengthen domestic semiconductor supply chains while supporting next-generation AI infrastructure.
The award is part of a broader effort by Washington to reduce reliance on overseas chip manufacturing and maintain technological leadership in strategic sectors like artificial intelligence.