SK hynix Charts Co-Packaged Optics Roadmap as AI Hardware Competition Shifts to System-Level Design
Memory manufacturer SK hynix has published a technology roadmap for co-packaged optics (CPO) in the peer-reviewed journal Nature Electronics, highlighting what the company sees as the next frontier in AI hardware development.
Co-packaged optics involves integrating optical connections directly into the same package as processors and memory, rather than routing